Process Engineer – Die to Wafer Hybrid Bonding

Applied Materials

5 days ago

3.9 on Glassdoor

Santa Clara, CA

Onsite

Full Time

Senior

0 applicants

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About this role

A Process Engineer at Applied Materials develops and optimizes manufacturing processes for display and semiconductor technologies, focusing on hybrid bonding for silicon photonics and co-packaged optics applications.

Skills

Qualifications

M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics, or related STEM disciplineHands-on experience in Die-to-Wafer or Wafer-to-Wafer bondingThin-die handling and alignment-critical processesDirect process engineer experience on mainstream semiconductor equipment2.5D/3D integration

About Applied Materials

appliedmaterials.com

Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.