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Process Engineer III – E3 Santa Clara Ca at Applied Materials - ApplyBlast

Process Engineer III – E3 Santa Clara Ca

Applied Materials

7 days ago

3.9 on Glassdoor

Santa Clara, California, United States

Onsite

Full Time

Senior

0 applicants

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About this role

The Process Engineer III role involves leading process development for next-generation thin-film deposition and surface treatment for advanced logic interconnects. The engineer will manage experiments from design through analysis, optimize deposition and plasma-based processes, and collaborate with hardware engineering teams to qualify new technologies. This position requires strong problem-solving skills and hands-on experience in semiconductor thin-film deposition or plasma processing.

Responsibilities

Own end-to-end process development experiments from DOE design through analysis
Develop and optimize thin-film deposition and plasma-based processes for performance targets
Partner with hardware engineering teams on chamber bring-up and design reviews

Skills

Qualifications

PhD in ChemistryPhD in Chemical EngineeringPhD in Materials SciencePhD in PhysicsPhD in Electrical Engineering

About Applied Materials

appliedmaterials.com

Headquarters

Santa Clara, California, United States

Company Size

10001+ employees

Founded

1967

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Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.