taiwansemiP1
The R&D Principal Engineer role at TSMC Technology, Inc. focuses on developing novel materials and integration solutions for advanced semiconductor devices and 3D structures. The position involves hands-on work in materials synthesis, thin-film deposition, cleanroom fabrication, and advanced characterization to support next-generation IC technologies. Collaboration with internal teams and university research partners drives innovation in thermal integration and future semiconductor advancements.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for taiwansemiP1.
7% above the average for this role
Senior Member of Technical Staff (SMTS) – Quantum Materials & Thin Films Engineering
GlobalFoundries
Researcher (Thin Film Deposition)
Air Liquide
Staff Materials Scientist – Thin Film Coatings
Vital Chemicals
Director, Thin Film Development
Intel
Thin Films Metals Module Development Engineer
Intel
PhD Scholarship
Oracle