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© All Rights Reserved. ApplyBlast.com
ASTARPRD
The Institute of Microelectronics is seeking a Research Engineer to drive the development and optimization of advanced wafer level packaging processes. This role involves working on groundbreaking technologies in high-density Fan-Out Wafer-Level Packaging, 2.5D/3D packaging, and co-packaged optics. The position offers the opportunity to contribute to high-impact projects at the forefront of semiconductor innovation.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for ASTARPRD.
ASTARPRD didn’t post a salary, so this is our estimate from similar listings.
8% below the average for this role
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