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© All Rights Reserved. ApplyBlast.com
ASTARPRD
The Research Engineer role focuses on developing and optimizing temporary bonding and debonding processes for wafer-level packaging within the Wafer-to-Wafer Bonding Module. This position supports the integration of process flows for advanced semiconductor packaging technologies, including laser debonding and back grinding. The role involves investigating process issues, executing design of experiments, and analyzing data to stabilize next-generation packaging solutions.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for ASTARPRD.
ASTARPRD didn’t post a salary, so this is our estimate from similar listings.
9% below the average for this role
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