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Research Fellow (Semiconductor Advanced Packaging) at Nanyang Technological University - ApplyBlast

Research Fellow (Semiconductor Advanced Packaging)

Nanyang Technological University

5 months ago

4.0 on Glassdoor

Singapore

Onsite

Full Time

Senior

0 applicants

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About this role

A Research Fellow at Nanyang Technological University will advance low-temperature Cu/dielectric hybrid bonding for fine-pitch, high-density interconnects by developing and validating a new flow with reliable dielectric sealing. The role integrates materials selection, wafer-level process development, and reliability demonstration to deliver a manufacturable 3D-integration solution supporting NTU's leadership in advanced packaging research.

Responsibilities

Develop and run Cu-Cu hybrid bonding flows for fine-pitch 3D integration
Optimize process windows to minimize contact resistance and voids in wafers
Characterize materials and interfaces using SEM, TEM, and electrical probing
Validate reliability and scalability via thermal cycling and electrical stress tests
Collaborate with tool vendors and industry partners while maintaining rigorous documentation

Skills

Qualifications

PhD in Materials SciencePhD in MicroelectronicsPhD in Electrical and Electronic Engineering

About Nanyang Technological University

ntu.edu.sg

Headquarters

Singapore, Central Region, Singapore

Company Size

10001+ employees

Founded

1990

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Nanyang Technological University is one of the top universities in Singapore offering undergraduate and postgraduate education in engineering, business, science, humanities, arts, social sciences, education and medicine.