HP
The SAW Process Engineer owns and sustains wafer dicing and singulation processes for MEMS and microfluidics manufacturing, ensuring yield and product reliability. This role provides technical leadership in precision mechanical cutting, defect reduction, and process control within high-volume production environments. The engineer collaborates cross-functionally to drive continuous improvement and supports new product introduction activities.
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Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for HP.
HP didn’t post a salary, so this is our estimate from similar listings.
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