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© All Rights Reserved. ApplyBlast.com
ASTARPRD
The Institute of Microelectronics is seeking a Scientist or Senior Scientist to advance advanced packaging platform technologies, including 2.5D/3D IC and Co-packaged optics. This role involves developing critical modules such as fine pitch multi-layer redistribution layers, micro bumping, and various bonding capabilities for heterogeneous chiplet integration. The position requires collaboration with cross-functional teams and external stakeholders to drive technology development and roadmap definition.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for ASTARPRD.
ASTARPRD didn’t post a salary, so this is our estimate from similar listings.
28% below the average for this role
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theuniversityoftexasataustin.com