ASTARPRD
The Institute of Microelectronics (IME) is seeking a Scientist or Senior Scientist to advance advanced packaging platform technologies, including 2.5D/3D IC and Co-packaged optics. This role involves developing critical modules such as fine pitch multi-layer redistribution layers, micro bumping, and various bonding capabilities for heterogeneous chiplet integration. The position offers an opportunity to collaborate with a dynamic team of researchers and external stakeholders to drive groundbreaking technologies.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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