Semiconductor Packaging Mechanical Engineer

Intel(1 month ago)

Arizona, United States, Phoenix, AZOnsiteFull TimeMedior$122,440 - $232,190Engineering

About this role

A mechanical engineer position on the Advanced Packaging Mechanical Analysis team supporting Intel Foundry in Chandler, AZ or Hillsboro, OR. The role focuses on thermo-mechanical simulation and analysis of advanced semiconductor packages while collaborating with multidisciplinary teams across design, technology integration, reliability, yield, and manufacturing. The position combines experimental and numerical approaches and requires regular onsite presence.

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Required Skills

Multiphysics Simulation
Finite Element
Thermal Analysis
Mechanical Analysis
Stress Analysis
Warpage Analysis
Delamination Analysis
Thermal Cycling
Reliability Assessment
Experimental Design

+5 more

Qualifications

Master's Degree in Mechanical Engineering
Master's Degree in Chemical Engineering
Master's Degree in Material Sciences
PhD Degree in Mechanical Engineering
PhD Degree in Chemical Engineering
PhD Degree in Material Sciences

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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