Intel

Semiconductor Packaging Mechanical Engineer

Intel

2 months ago
Arizona
Onsite
Full Time
Medior
0 applicants
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Intel
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About this role

A mechanical engineer position on the Advanced Packaging Mechanical Analysis team supporting Intel Foundry in Chandler, AZ or Hillsboro, OR. The role focuses on thermo-mechanical simulation and analysis of advanced semiconductor packages while collaborating with multidisciplinary teams across design, technology integration, reliability, yield, and manufacturing. The position combines experimental and numerical approaches and requires regular onsite presence.

Skills

Qualifications

Master's Degree in Mechanical EngineeringMaster's Degree in Chemical EngineeringMaster's Degree in Material SciencesPhD Degree in Mechanical EngineeringPhD Degree in Chemical Engineering
Intel

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

About Intel

Headquarters

San Francisco, CA

Company Size

201-500 employees

Founded

2018

Industry

Technology

Glassdoor Rating

4.2 / 5

Leadership Team

Sarah Johnson

Chief Executive Officer

Michael Chen

Chief Technology Officer

Emily Williams

VP of Engineering

David Rodriguez

VP of Product

Jessica Thompson

Chief Financial Officer

Andrew Park

VP of Sales

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