TalentCloud Group Recruitment
This role involves leading top-level physical layout integration for advanced mixed-signal ASICs and driving floorplanning, chip finishing, and physical verification through to successful tape-out. The position requires collaborating with analog, RF, digital, and system designers to contribute to ultra-low-power SoCs, imaging devices, and advanced RF technologies. It offers the opportunity to shape physical design methodologies and layout best practices within a collaborative, internationally recognized Swiss engineering organization.
Headquarters
Zürich, Zurich, Switzerland
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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TalentCloud Group Recruitment didn’t post a salary, so this is our estimate from similar listings.
24% below the average for this role