Senior Engineer, Advanced Packaging Integration Engineering
Eightfold(25 days ago)
About this role
An Advanced Packaging Integration Engineer at Micron’s Advanced Packaging Technology Development (APTD) team supports development and transfer of advanced package technologies for high-performance memory products. The role focuses on enabling manufacturable, high-quality packaging solutions that meet performance, cost, reliability, and schedule targets to support AI and high-performance compute applications. The engineer collaborates cross-functionally to drive technology deployment from development through high-volume production.
Required Skills
- Python
- R
- SQL
- Visual Basic
- Data Analytics
- SPC
- DOE
- Defect Analysis
- Process Integration
- Yield Improvement
+5 more
Qualifications
- B.S./M.S./Ph.D. in Electrical, Mechanical, Chemical Engineering, Physics, Materials, or Related Technical Field
About Eightfold
eightfold.aiMaximize your workforce's potential with our advanced AI Talent Intelligence Platform for talent acquisition and development. Unlock the full potential of your workforce today.
View more jobs at Eightfold →Apply instantly with AI
Let ApplyBlast auto-apply to jobs like this for you. Save hours on applications and land your dream job faster.
More jobs at Eightfold
Similar Jobs
Advanced Packaging Technologist
OpenAI(4 days ago)
Packaging Module Development Engineer
Intel(1 month ago)
MTS, ULP CMOS Advanced packaging Integrator
GlobalFoundries(8 months ago)
Technical Director – Advanced Packaging
Applied Materials(3 months ago)
Principal Engineer/MTS Advanced Packaging Diffusion Process Engineering
GlobalFoundries(5 months ago)
Senior MTS, Advanced Packaging Integration
Applied Materials(2 months ago)