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© All Rights Reserved. ApplyBlast.com
Axiado
A Senior IC Packaging Engineer at Axiado Corporation leads advanced IC and System-in-package (SiP) packaging architecture and technology development in a fast-growing startup environment. The role requires technical leadership, hands-on expertise, and system-level thinking to drive high-performance, low-power packaging solutions.
Headquarters
San Jose, California, United States
Company Size
51-200 employees
Founded
2017
Axiado Corporation develops AI-driven, hardware-anchored platform cybersecurity solutions for cloud datacenters, 5G base stations, and network infrastructure. Their flagship product, the Trusted Control/Compute Unit (TCU), is a single-chip SoC that integrates root-of-trust, BMC, TPM, HSM, SecureNIC, firewall, and AI/ML capabilities to provide real-time, preemptive protection against network, peripheral, and physical side-channel attacks. Axiado also delivers AI-driven system management technologies including dynamic thermal management (DTM) and dynamic voltage and frequency scaling (DVFS) to improve energy efficiency in accelerated computing platforms.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Axiado.
Axiado didn’t post a salary, so this is our estimate from similar listings.
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