qant
The Senior Integrated Photonics Packaging Engineer will lead the transition of Q.ANT’s photonic computing technology from research prototypes to high‑performance, miniaturized modules, focusing on RF and electro‑optical packaging. The role involves defining and validating high‑density packaging solutions, managing global supplier collaborations, and ensuring signal and power integrity while driving innovative packaging architectures.
Headquarters
Stuttgart, Baden-Württemberg, Germany
Company Size
51-200 employees
Founded
2018
Q.ANT (Q.ANT GmbH) develops photonic computing hardware and systems to accelerate AI and high-performance computing. Their photonic processors and native processing servers are designed to be greener, quieter and up to 30× more energy-efficient than conventional electronic solutions for AI datacenters and HPC workloads. Q.ANT targets operators and enterprises seeking energy- and space-efficient compute for large-scale inference and training.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for qant.
qant didn’t post a salary, so this is our estimate from similar listings.
40% below the average for this role
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