Senior Manager, Semiconductor IC Packaging & Assembly Engineering

A Senior Manager of Semiconductor IC Packaging Assembly Engineering at Renesas leads sustaining engineering and high-volume manufacturing execution for advanced packaging technologies, including AI/data center power applications and wide-bandgap materials. The role focuses on yield performance, process stability, and quality control while managing NPI transitions to scalable production and collaborating with global OSAT partners. This position serves as a key technical interface to translate package development requirements into robust, cost-competitive manufacturing solutions.