Lyte
Lyte is seeking an experienced Package Substrate Design Engineer to own the physical design and manufacturing release of package and substrate solutions for its 4D FMCW LiDAR platform. The role involves collaborating with US teams and Asian partners to deliver manufacturable flip-chip, wire-bond, and advanced packaging solutions while ensuring design rule compliance and production readiness. This position requires strong technical expertise in substrate layout, test interface hardware design, and cross-functional project management.
Headquarters
Sunnyvale, California, United States
Company Size
1-10 employees
Founded
2017
Lyte is a technology company operating in the robotics and simulation space, with a focus on areas such as NVIDIA Holoscan integration, scan-to-simulation workflows, and robotics safety. The company develops technology solutions aimed at advancing physical AI and autonomous systems. Lyte also provides news, careers, and support resources through its website.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Lyte.
Lyte didn’t post a salary, so this is our estimate from similar listings.
5% below the average for this role