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© All Rights Reserved. ApplyBlast.com
Delos Data
A Senior Packaging Engineer at this startup architects and delivers advanced multi-die IC packages for high-performance AI accelerators, focusing on package architecture, substrate design, and manufacturability. The role involves defining package specifications, managing vendor relationships with TSMC and OSATs, and collaborating with cross-functional teams to ensure system-level requirements are met. This position supports package-level bring-up, failure analysis, and the adoption of emerging packaging technologies.
Delos Data is a technology company building interconnect infrastructure purpose-built for AI inference, combining software, systems, and silicon expertise. Their flagship product, Nonstop AI™, enables large-scale GPU clusters with a one-hop, open architecture that improves how compute is distributed and memory is interconnected. They focus on scaling AI inference beyond traditional HPC and cloud approaches to deliver faster, more capable intelligence.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Delos Data.