Senior Program Manager
Intel(1 month ago)
About this role
This role sits within Intel Foundry’s Advanced Packaging Technology Development team, focused on advancing substrate packaging and wafer assembly solutions for next-generation AI devices. The position partners closely with global substrate suppliers and internal integration teams to support deployment and scaling of Intel’s next-generation advanced packaging substrate technology (EMIB-T). It is an experienced hire role based in Tokyo, Japan with regular onsite presence and travel to supplier sites.
Required Skills
- Advanced Packaging
- Substrate Technology
- Wafer Assembly
- Supplier Management
- Technology Integration
- Capacity Management
- Lead Time Analysis
- Yield Improvement
- Process Development
- Process Control
+11 more
Qualifications
- BS in Science or Engineering
- MS in Science or Engineering
- PhD in Science or Engineering
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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