infineon
A Package/Process Development Engineer at Infineon focuses on developing and transitioning advanced packaging technologies for next-generation power modules, working with global partners and leading cross-functional teams.
Infineon Technologies is a global semiconductor company that delivers chips and system solutions for automotive, industrial, IoT, and consumer markets. Its product portfolio includes microcontrollers, sensors, power-management ICs and power semiconductors (e.g., MOSFETs/IGBTs), memories, connectivity (USB, Bluetooth, Wi‑Fi), LED drivers, security controllers and radiation‑hardened devices. Infineon focuses on energy efficiency, safety and security to enable applications from electric vehicles and industrial drives to smart-home and IoT devices. OEMs and system designers choose Infineon for its integrated hardware/software solutions, reliability, and global support.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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