radwin
RADWIN is seeking a hands-on Senior RF Hardware Engineer to develop next-generation wireless hardware based on Qualcomm Wi-Fi chipsets, including RF front ends and frequency-conversion circuits. The role involves taking technical ownership from system analysis and schematic design through board bring-up, calibration, and performance optimization. You will collaborate with engineering teams and technology vendors to bring designs into production.
Headquarters
Tel Aviv-Yafo, Tel Aviv, Israel
Company Size
201-500 employees
Founded
1997
RADWIN delivers carrier-grade fixed wireless access and mobility solutions that provide reliable, high-capacity wireless broadband and backhaul. The company offers PtP and PtMP wireless platforms, subscriber units, and OSS tools for end-to-end network deployment and management. Serving operators and enterprises worldwide, RADWIN connects people, businesses, and infrastructure with scalable wireless links across backhaul, access, and mobility applications. With a focus on reliability, performance, and global reach, RADWIN enables rapid deployment of wireless networks for diverse telecom, transportation, and enterprise needs.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for radwin.
radwin didn’t post a salary, so this is our estimate from similar listings.
37% below the average for this role
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