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UTSG
The TIE is seeking a senior or principal engineer specialized in TCAD modeling to develop multi-physics silicon-calibrated models for 3D heterogeneous integration devices and interfaces. The role involves collaborating with cross-disciplinary teams to predict device performance and reliability, and influence next-generation semiconductor processes.
N/A
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for UTSG.
UTSG didn’t post a salary, so this is our estimate from similar listings.
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