Silicon Packaging Architect / Engineer

Intel(1 month ago)

California, Santa Clara, CA, United StatesOnsiteFull TimeSenior$122,440 - $232,190Silicon Engineering

About this role

Intel’s Wireless Communications Solutions (WCS) team is hiring a Silicon Packaging Architect/Engineer to shape advanced semiconductor package architectures for wireless products including Wi‑Fi, Bluetooth, and mmWave. The role sits within Intel’s Silicon Engineering Group and supports next-generation connected device experiences by bringing packaging technologies from concept through production across multiple US sites.

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Required Skills

Semiconductor Packaging
Package Architecture
RF Packaging
Thermal Simulation
Mechanical Simulation
FEA Analysis
Reliability Engineering
Packaging Materials
Assembly Processes
HVM Ramp

+11 more

Qualifications

BS in Mechanical Engineering
BS in Electrical Engineering
BS in Materials Science/Engineering
BS in Physics
MS in Related Field
PhD in Related Field

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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