Silicon Photonic Packaging & Process Engineer

The Principal Silicon Photonic Packaging & Process Engineer will lead the development and scaling of precision opto‑mechanical assembly processes for LiDAR modules, collaborating with photonics, mechanical, and test teams and partnering with contract manufacturers to qualify lines and improve yields. The role involves designing robust package solutions, optimizing high‑precision die‑attach and lens‑assembly processes, and driving continuous improvement from R&D to high‑volume production, with up to 25% travel required.