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SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTC at GlobalFoundries - ApplyBlast

SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTC

GlobalFoundries

6 months ago

3.5 on Glassdoor

Essex Junction

Onsite

Full Time

Senior

0 applicants

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About this role

An Advanced Packaging Engineer at GlobalFoundries focuses on 2.5D/3D heterogeneous integration technologies, leading integration strategies for advanced packaging solutions and collaborating with cross-functional teams to develop new capabilities.

Skills

Qualifications

Master’s in Electrical EngineeringMaster’s in Mechanical EngineeringMaster’s in Chemical EngineeringMaster’s in Materials ScienceMaster’s in Physics

About GlobalFoundries

gf.com

Headquarters

Malta, New York, United States

Company Size

10001+ employees

Founded

2009

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GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.