Sr Manager, Packaging Assembly Operation

The Senior Manager of Semiconductor IC Packaging & Assembly Operations leads high-volume semiconductor assembly operations for advanced packaging technologies, ensuring production output, customer commitments, and revenue targets are met. This role oversees AI/data center infrastructure power packaging applications, including Smart Power Stages and Wide-Bandgap technologies, while managing assembly line readiness, yield performance, and quality control. The position requires close collaboration with Package Engineering, Supply Chain Management, and external OSAT partners to drive factory performance and continuous improvement.