Absolics Inc
This role involves simulation, modeling, and interpretation of multiphysics behavior across advanced packaging architectures, from die-level interconnects to system-level integration. The engineer builds and validates predictive models for mechanical and electrical performance, translating simulation outputs into design rules and go/no-go decisions for process and product teams. Core responsibilities include finite element analysis, material characterization, failure mode prediction, and co-optimization of RDL/buildup layers.
Absolics glass substrates provide differentiated value such as increased performance, reduced power consumption, and form factor to HPC-related packaging companies, data centers, AI, etc.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Absolics Inc.
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