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© All Rights Reserved. ApplyBlast.com
infineon
This role involves establishing new assembly processes for mold and laser marking capabilities while supporting package development, ramp-up, and platform extensions within the semiconductor industry. The incumbent will act as a technical lead for cross-functional teams, driving process optimization, supplier liaison, and knowledge transfer to operations. Knowledge of semiconductor packaging technologies and statistical analytical tools like DOE and FMEA is essential for executing these responsibilities.
Infineon Technologies is a global semiconductor company that delivers chips and system solutions for automotive, industrial, IoT, and consumer markets. Its product portfolio includes microcontrollers, sensors, power-management ICs and power semiconductors (e.g., MOSFETs/IGBTs), memories, connectivity (USB, Bluetooth, Wi‑Fi), LED drivers, security controllers and radiation‑hardened devices. Infineon focuses on energy efficiency, safety and security to enable applications from electric vehicles and industrial drives to smart-home and IoT devices. OEMs and system designers choose Infineon for its integrated hardware/software solutions, reliability, and global support.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for infineon.
infineon didn’t post a salary, so this is our estimate from similar listings.
142% above the average for this role