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© All Rights Reserved. ApplyBlast.com
TTM Technologies
The Staff Engineer – Microelectronics Packaging Technology will design and develop highly integrated System-In-Packages (SiP) and module sub-systems for Aerospace, Defense, and Industrial applications. This role involves providing technical leadership in package architecture selection, performing complex mechanical and thermal simulations, and optimizing 3D package designs. The position requires collaboration with cross-functional teams to support the full technology development cycle from conceptualization to manufacturing readiness.
Headquarters
Santa Ana, California, United States
Company Size
10001+ employees
Founded
1998
TTM Technologies is a global advanced printed circuit board (PCB) manufacturer and RF supplier delivering high-performance circuit solutions for aerospace, defense, communications, medical and industrial markets. It offers a broad portfolio of rigid, flex, RF/microwave and advanced-substrate PCBs along with engineering support, assembly and supply-chain services. TTM emphasizes innovation, quality and sustainability, holding industry certifications and operating manufacturing and support facilities worldwide. Customers rely on TTM for its technology expertise, scale and integrated solutions for complex electronic systems.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for TTM Technologies.
28% above the average for this role
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