Renesas 瑞萨电子
The Staff Package Design Engineer role focuses on the architecture and physical design of next-generation semiconductor packages, including 2.5D/3D heterogeneous integration and chiplet-based architectures. This position serves as a technical focal point, guiding cross-functional alignment with global design, signal integrity, and product engineering teams. The role involves defining packaging design rules, managing complex design cycles, and providing technical mentorship to junior engineers.
作为全球领先的微控制器、模拟功率器件和SoC产品供应商,瑞萨电子通过提供可靠的创新嵌入式设计,与您共创无限未来。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Renesas 瑞萨电子 didn’t post a salary, so this is our estimate from similar listings.
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