Staff Product Yield Enhancement Engineer, HBM
micron
About this role
A Product Yield Enhancement (PYE) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer at Micron Technology will be responsible for taking next generation HBM devices from design to mass production, focusing on failure analysis of test and internal qualification failures to enhance product reliability and speed up production. The role involves collaborating with various teams and maintaining in-depth knowledge of HBM technology, alongside presenting failure analysis findings to management and quality teams.
Skills
Qualifications
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Salary
$106k – $142k
per year