Summer Intern - Hardware Engineering
Harman International
About this role
A Hardware (HW) Engineering Summer Intern at HARMAN Automotive will contribute to the design and development of display-based hardware, working on circuit design, debugging, verification testing, and documentation. The role supports the hardware development life cycle and involves collaboration with cross-functional teams including mechanical, software, and systems engineering. This is a time-limited internship reporting to the Hardware Development Engineering Manager.
Skills
Qualifications
About Harman International
harman.comN/A
Recent company news
HARMAN NewsroomHARMAN Completes Sound United Acquisition to Expand Premium Audio Leadership
Sep 23, 2025
HARMAN NewsroomHARMAN Invests ₹345 Crore to Expand Pune Automotive Manufacturing Plant, Accelerating India’s Role in the Future of Connected & Sustainable Mobility
Oct 27, 2025
HARMAN NewsroomHARMAN Recognized as “Connected Car Solution Provider of The Year” by 2025 AutoTech Breakthrough Awards
Oct 16, 2025
Samsung Global NewsroomHARMAN To Acquire ZF’s ADAS Business
Dec 23, 2025
CT InsiderStamford-based audio-electronics company Harman to make nearly $2 billion acquisition
Dec 27, 2025
About Harman International
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for Harman International.
Salary
$42k – $76k
per year
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