Team Leader, Advanced Packaging

The Team Leader, Advanced Packaging at IQM leads the development of backend fabrication processes and advanced packaging technologies for next-generation quantum processing units (QPUs). This role involves bridging early-stage research with production, setting technical direction, and coaching a dedicated team to transform promising concepts into manufacturable processes. The position requires strong leadership in a fast-moving R&D environment, focusing on data-driven decision-making and cross-functional collaboration.