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© All Rights Reserved. ApplyBlast.com
UTSG
The Thermal Mechanical Modeling Engineer will lead and execute thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material semiconductor packages. The role is part of the Texas Institute for Electronics (TIE) and supports development of package-level models and design enablement to advance domestic semiconductor manufacturing. The position is based in Austin, TX and involves collaboration with industry partners, vendors, OSATs, and foundries.
N/A
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for UTSG.
UTSG didn’t post a salary, so this is our estimate from similar listings.
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