The University of Texas at Austin Student Government

Thermal Mechanical Modeling Engineer

The University of Texas at Austin Student Government(2 months ago)

Austin, TXOnsiteFull TimeSenior$163,261 - $219,766 (estimated)Texas Institute for Electronics
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About this role

The Thermal Mechanical Modeling Engineer will lead and execute thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material semiconductor packages. The role is part of the Texas Institute for Electronics (TIE) and supports development of package-level models and design enablement to advance domestic semiconductor manufacturing. The position is based in Austin, TX and involves collaboration with industry partners, vendors, OSATs, and foundries.

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Required Skills

  • Thermal Simulation
  • Mechanical Simulation
  • Multiphysics
  • EDA Tools
  • Model Extraction
  • Scripting
  • Thermal Management
  • Stress Analysis
  • Co-Simulation
  • Package Modeling

Qualifications

  • BS in Electrical Engineering
  • MS in Electrical Engineering
  • PhD in Electrical Engineering
The University of Texas at Austin Student Government

About The University of Texas at Austin Student Government

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