Thermal Mechanical Modeling Engineer
The University of Texas at Austin Student Government(2 months ago)
About this role
The Thermal Mechanical Modeling Engineer will lead and execute thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material semiconductor packages. The role is part of the Texas Institute for Electronics (TIE) and supports development of package-level models and design enablement to advance domestic semiconductor manufacturing. The position is based in Austin, TX and involves collaboration with industry partners, vendors, OSATs, and foundries.
Required Skills
- Thermal Simulation
- Mechanical Simulation
- Multiphysics
- EDA Tools
- Model Extraction
- Scripting
- Thermal Management
- Stress Analysis
- Co-Simulation
- Package Modeling
Qualifications
- BS in Electrical Engineering
- MS in Electrical Engineering
- PhD in Electrical Engineering
About The University of Texas at Austin Student Government
utsg.orgN/A
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