Thermo-Mechanical Reliability Engineer

This role focuses on the thermo-mechanical reliability of next-generation semiconductor packages, combining hands-on materials characterisation with finite element modelling. The position involves conducting material and interface testing, building multi-scale simulation models, and validating results on real packaged test vehicles. Collaboration with colleagues at IME and industry partners is essential to address critical challenges such as warpage, delamination, and interface fracture as package formats scale up.