Wafer Backside Processing Technician
Teledyne Defense Electronics, LLC(2 months ago)
About this role
Technician position supporting backside wafer processing and assembly within Teledyne's semiconductor operations. The role is based in an ISO Class 6 cleanroom on second shift and contributes to production and engineering priorities to maintain product quality and throughput. The position works with die preparation and packaging activities in a high-reliability manufacturing environment.
Required Skills
- Backside Processing
- Hybridization
- Wicking
- Wire Bonding
- Cleanroom Protocols
- SPC
- Metrology
- Chemical Handling
- Inspection
- Documentation
Qualifications
- High School Diploma
- Technical Coursework (Preferred)
About Teledyne Defense Electronics, LLC
teledynedefenseelectronics.comTeledyne Aerospace & Defense Electronics specializes in providing high-reliability solutions for the defense, space, and commercial markets, particularly in demanding environments. The company offers a range of innovative products including avionics systems, radar systems, satellite modems, and secure communication solutions. With a focus on cutting-edge technology and engineering excellence, Teledyne aims to meet the complex needs of military and commercial applications in aerospace and defense sectors.
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