Wafer Dicing Technician
Teledyne Defense Electronics, LLC(20 days ago)
About this role
Join Teledyne Imaging Sensors as a Wafer Dicing Technician and be part of a mission-focused team working on advanced infrared sensors used in space exploration and defense. The role involves supporting wafer dicing operations, collaborating with engineers, and ensuring quality and safety standards are met.
Required Skills
- Microscope
- Metrology
- Process Control
- MES
- Safety Procedures
- Mechanical Drawings
- Digital Microscope
- Reporting
- Data Recording
- Inspection
Qualifications
- High School Diploma
- 3 Years Relevant Experience
About Teledyne Defense Electronics, LLC
teledynedefenseelectronics.comTeledyne Aerospace & Defense Electronics specializes in providing high-reliability solutions for the defense, space, and commercial markets, particularly in demanding environments. The company offers a range of innovative products including avionics systems, radar systems, satellite modems, and secure communication solutions. With a focus on cutting-edge technology and engineering excellence, Teledyne aims to meet the complex needs of military and commercial applications in aerospace and defense sectors.
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