2026 Intern - Packaging Engineer
NXP Semiconductors(5 months ago)
About this role
A packaging front-end R&D intern focused on IC (integrated circuit) packaging technology research and development. The role supports development projects and collaborates with global teams across multiple regions.
Required Skills
- IC Packaging
- Process Development
- Material Interfaces
- Failure Analysis
- Project Leadership
- Global Collaboration
- English Communication
- Research
Qualifications
- Bachelor's Degree (In Progress)
- Master's Degree (In Progress)
- Metallic Materials Engineering
- Polymer Materials Engineering
- Mechanical Engineering and Automation
About NXP Semiconductors
nxp.comNXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
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