Layout / Simulations Engineer Intern

Marvell Technology(27 days ago)

Bucharest, RomaniaOnsitePart TimeIntern$44,075 - $64,240 (estimated)Package Engineering

About this role

An internship in Marvell's package engineering group focused on integrated circuit packaging for high-end applications across enterprise, cloud/AI, and carrier architectures. The role supports the design and verification of IC package interconnects and contributes to package planning and development alongside product development teams. This position is intended for students currently pursuing a BS degree in Electronics or a related technical field.

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Required Skills

Package Design
Cadence APD
SI/PI Simulation
Electronics
PCB Routing
Layout
Signal Theory
Circuit Simulation
Microwave Theory
Communication

+3 more

Qualifications

BS in Electronics (In Progress)

About Marvell Technology

marvell.com

Designed for your current needs and future ambitions, Marvell delivers the data infrastructure technology transforming tomorrow’s enterprise, cloud, automotive, and carrier architectures for the better.

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