Tower Semiconductor
The Advanced Packaging Engineer in Israel will drive process development, establish new tools, and define procedures while collaborating with vendors and internal Fab departments. The role involves managing multiple interfaces, prioritizing tasks, and leading technological aspects of new product introductions.
Headquarters
Migdal Ha'emeq, Northern District, Israel
Company Size
5001-10000 employees
Founded
1993
Learn More Learn More Learn More Learn More Learn More Technology A broad range of advanced customizable and innovative analog process technologies for growing markets such as infrastructure, automotive, mobile, medical, industrial, consumer and aerospace and defense, among others. Read More Manufacturing Worldwide operational footprint with multi-fab production options in three geographic regions, providing global […]
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Tower Semiconductor.
Tower Semiconductor didn’t post a salary, so this is our estimate from similar listings.
13% above the average for this role
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