Principal Engineer/MTS Advanced Packaging Diffusion Process Engineering
GlobalFoundries(5 months ago)
About this role
GlobalFoundries Singapore is hiring an experienced Diffusion/Advanced Packaging Process Engineer to join its new 300mm Advanced Packaging Center. The role focuses on establishing and supporting wafer-level and die-to-wafer bonding-related processes for multi-stack packaging in a high-volume fab environment. The position is based in the Giga Fab in Singapore and partners closely with equipment and manufacturing teams to bring new capabilities into production.
Required Skills
- Advanced Packaging
- Diffusion Processes
- Process Development
- Process Optimization
- Etch Processes
- Bonding
- Debonding
- Plasma Processing
- UV Processing
- Die Reconstitution
+15 more
Qualifications
- BS in Electrical Engineering
- BS in Chemical Engineering
- BS in Science
- BS in Solid State Physics
- MS in Electrical Engineering
- MS in Chemical Engineering
- MS in Science
- MS in Solid State Physics
- PhD in Electrical Engineering
- PhD in Chemical Engineering
+2 more
About GlobalFoundries
gf.comGlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.
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