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Advanced Packaging Engineer, Principal at Astera Labs - ApplyBlast

Advanced Packaging Engineer, Principal

Astera Labs

2 months ago

4.3 on Glassdoor

San Jose, California, United States

Onsite

Full Time

Senior

0 applicants

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About this role

Astera Labs is seeking a senior individual contributor to lead advanced packaging research and development for next‑generation photonics products that support scale‑up and scale‑out AI infrastructure. The role focuses on setting technical direction, driving packaging technology development, and collaborating with OSATs, tool vendors, and material suppliers.

Responsibilities

Lead R&D for advanced packaging of optical chips
Define and optimize wafer‑level, panel‑level, and die‑level packaging flows
Characterize and continuously improve yield, reliability, and process capability

Skills

Qualifications

B.S. in Electrical EngineeringM.S. in Electrical EngineeringPh.D. in Electrical Engineering

About Astera Labs

asteralabs.com

Headquarters

Santa Clara, California, United States

Company Size

201-500 employees

Founded

2017

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Astera Labs is a semiconductor company that builds purpose‑built connectivity silicon and system solutions for rack‑scale AI and modern data centers. They design high‑speed retimers, PHY/connectivity devices, interposers and companion firmware/software that extend signal reach, improve link reliability, and enable PCIe/CXL and other accelerator interconnects across cables and backplanes. Astera’s products add telemetry, error monitoring and management features to simplify integration for OEMs, cloud providers and hyperscalers. The company focuses on enabling scalable, low‑latency multi‑node AI training and inference systems.