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Advanced Packaging Engineer at ASM - ApplyBlast

Advanced Packaging Engineer

ASM

3 months ago

2.5 on Glassdoor

Singapore, Singapore, Singapore

Onsite

Full Time

Senior

0 applicants

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About this role

The role leads the design and development of next‑generation semiconductor vacuum systems, overseeing system architecture, automation integration, and project execution while ensuring safety, quality, and performance standards. The engineer collaborates cross‑functionally, provides technical support, and drives continuous improvement initiatives within ASM's Advanced Packaging team.

Responsibilities

Lead design and development of semiconductor vacuum systems
Develop and implement automation strategies using PLCs and SCADA
Manage project timelines, budgets, and resources
Provide technical support and troubleshooting for equipment and automation systems
Create and revise CAD models and detailed drawings using Creo Parametric

Skills

Qualifications

Bachelor's in Mechanical EngineeringMaster's in Mechanical EngineeringPhD in Mechanical Engineering

About ASM

asm.com

Headquarters

Almere, Flevoland, Netherlands

Company Size

1001-5000 employees

Founded

1968

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ASM is a materials discovery company that advances semiconductor progress through atomic layering and thin-film deposition technologies, including atomic layer deposition (ALD), epitaxy, PECVD, and vertical furnace processes. The company builds machines that enable the production of smaller, more advanced chips by engineering the functional material layers that define performance, power, and reliability in modern devices. With nearly 60 years of materials innovation, ASM serves chipmakers worldwide and plays a key role in enabling next-generation semiconductor scaling for applications including AI.