GlobalFoundries
This role leads post-Fab process development to meet customer requirements, focusing on wafer finishing and assembly processes for silicon photonics and other product lines. The position involves driving semiconductor process development in CMP, wafer thinning, and dicing while collaborating with internal teams and suppliers to advance packaging roadmaps. The engineer will also lead next-generation packaging development, resolve technical issues, and drive end-to-end process integration for new capabilities.
Headquarters
Malta, New York, United States
Company Size
10001+ employees
Founded
2009
GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for GlobalFoundries.
57% above the average for this role
GlobalFoundries Announces Secondary Public Offering of 20 Million Shares and $300 Million Share Repurchase Initiative
18 hours ago
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