Advanced Packaging Modeling Expert - FEA

Applied Materials(1 month ago)

Santa Clara, CAOnsiteFull TimeSenior$152,000 - $208,500Engineering

About this role

A Senior FEA Engineer on the Advanced Packaging Modeling team at Applied Materials will lead development of thermal-mechanical simulations to support next-generation semiconductor packaging technologies. The role delivers simulation-driven insights that inform packaging architecture, materials, and process decisions while collaborating with cross-functional engineering and research teams. The position is based in Santa Clara, CA and contributes to Applied's semiconductor and display materials engineering efforts.

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Required Skills

FEA Modeling
Thermal Modeling
Multi-Physics
ANSYS
Abaqus
COMSOL
Materials Science
Thermo-Mechanical
Reliability Analysis
Python Scripting

+4 more

Qualifications

M.S. in Mechanical Engineering, Materials Science, or Applied Physics
Ph.D. in Mechanical Engineering, Materials Science, or Applied Physics

About Applied Materials

appliedmaterials.com

Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.

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