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© All Rights Reserved. ApplyBlast.com
qorvo
A Packaging Engineer at Qorvo focuses on advancing simulation methodologies for diverse semiconductor products to improve reliability, quality, and performance. The role involves conducting thermal and mechanical FEA simulations, refining modeling techniques, and collaborating with global teams to drive technology improvements. This position requires a Ph.D. in a relevant engineering field and deep expertise in simulation tools and packaging technologies.
Headquarters
Greensboro, North Carolina, United States
Company Size
5001-10000 employees
Founded
2015
Qorvo is a semiconductor company that designs and manufactures advanced RF and power solutions for mobile, infrastructure, industrial, and defense markets. Its product portfolio includes power amplifiers, RF front‑end modules, filters, antenna tuners, PMICs, SiC/GaN power devices, and sensor technologies that address wireless connectivity, 5G, broadband, radar, and IoT applications. Qorvo positions itself as a systems‑level partner, combining high‑performance components, manufacturing scale, and engineering support to solve complex RF and power challenges for global customers.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for qorvo.
qorvo didn’t post a salary, so this is our estimate from similar listings.
12% below the average for this role
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