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Advanced Packaging Process Engineer at Tenstorrent - ApplyBlast

Advanced Packaging Process Engineer

Tenstorrent

5 months ago

3.6 on Glassdoor

Santa Clara, California, United States

Hybrid

Full Time

Senior

0 applicants

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About this role

An Advanced Packaging Process Engineer at Tenstorrent develops and implements advanced packaging technologies for 2.5D/3D chiplet products, working closely with foundries and OSATs to improve performance and manufacturability for AI/ML applications.

Skills

Qualifications

MS/PhD in Materials, Mechanical, Electrical, Physics, or related field5+ years in advanced packaging for high-performance semiconductors

About Tenstorrent

tenstorrent.com

Headquarters

Toronto, Ontario, Canada

Company Size

201-500 employees

Founded

2016

View Profile

Tenstorrent is a next‑generation computing company that builds computers optimized for AI workloads. They design AI silicon and systems—leveraging RISC‑V, custom ASICs, and advanced architecture—alongside neural‑network compilers and software to accelerate training and inference. Headquartered in the U.S. with offices in Austin and Silicon Valley and global teams in Toronto, Belgrade, Seoul, Tokyo, and Bangalore, Tenstorrent brings together expertise in computer architecture, ASIC design, and compiler technology. Their hardware‑plus‑software approach targets developers, researchers, and enterprises needing scalable, efficient AI compute.