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marvellsemiconductor.com
The Advanced Packaging R&D team develops packaging technology roadmaps and innovative solutions for next-generation high-performance computing, AI, and networking solutions. The role involves defining package architectures, leading co-design efforts, and driving technology feasibility from concept to productization. This position requires deep expertise in signal and power integrity, advanced packaging technologies, and cross-functional collaboration with global partners.
Headquarters
Santa Clara, California, United States
Company Size
1001-5000 employees
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for marvellsemiconductor.com.
marvellsemiconductor.com didn’t post a salary, so this is our estimate from similar listings.
28% below the average for this role
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