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© All Rights Reserved. ApplyBlast.com
Amkor Technology
Amkor Technology is seeking a VP, Advanced Packaging Technology Lead to drive the strategy, development, and commercialization of advanced IC packaging solutions for computing, networking, and AI markets. This role serves as a key interface between the Chiplets/FCBGA Business Unit, factory leadership, Tier 1 customers, and global R&D teams to execute technology roadmaps and packaging initiatives. The position involves leading cross-functional teams, managing customer engagement, and overseeing product development from qualification through sustained business growth.
Headquarters
Tempe, Arizona, United States
Company Size
10001+ employees
Founded
1968
World's largest US-based semiconductor packaging & test services provider. Advanced OSAT solutions for global chip manufacturers.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Amkor Technology.
Amkor Technology didn’t post a salary, so this is our estimate from similar listings.
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