Advanced Packaging Technologist & Lead
Cerebras Systems(8 hours ago)
About this role
Cerebras Systems develops innovative AI hardware with a revolutionary wafer-scale architecture, enabling industry-leading speed and efficiency for large-scale machine learning applications. The company serves top model labs, enterprises, and startups, partnering with industry giants like OpenAI.
Required Skills
- Packaging
- Semiconductors
- Bonding
- Interconnects
- Materials
- Simulation
- Design
- Assembly
- Failure Analysis
- Low-CTE Substrates
Qualifications
- BS in Electrical Engineering
- MS in Electrical Engineering or similar
- 10+ years in advanced packaging
About Cerebras Systems
cerebras.aiCerebras builds purpose‑built AI compute systems centered on its wafer‑scale processors to accelerate training and inference of large neural networks. Their integrated hardware‑and‑software platform delivers high throughput, low latency, and very large on‑chip memory/interconnect to shorten time‑to‑train for demanding AI workloads. Cerebras targets research labs and enterprises that need to scale experiments and deploy large models more quickly, pairing systems, tooling, and support to simplify large‑model development.
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