AI-Enabled Wafer Probe Test Optimization and Yield Analytics

The NAND Probe Product Engineering Intern will undertake an engineering project focused on wafer probe testing, silicon characterization, yield analysis, and test optimization. Working under the guidance of experienced Product Engineers, the intern will study how probe test strategies are developed and evaluated across product development and manufacturing phases. The project provides exposure to advanced NAND semiconductor technologies, wafer-level testing, statistical data analysis, yield improvement methodologies, and Artificial Intelligence-enabled engineering workflows.